Semiconductor Chip High and Low Temperature Testing Machines

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Semiconductor chip high and low temperature test is a necessary test equipment for metal, components, electronics and other material industries. It is used to test the degree of material structure or composite material that can be endured in a continuous environment of high temperature and low temperature in a short time. The chemical change or physical damage caused by thermal expansion and contraction of the internal test sample.
The high and low temperature test of semiconductor chips has simple and convenient operation performance and reliable equipment performance. Physical changes in defense industry, aerospace, BGA, PCB base, electronic chip IC, semiconductor ceramics and polymer materials.

Special attention should be paid to the high and low temperature test of semiconductor chips. The high and low temperature test of semiconductor chips cannot be easily opened during use. The main reasons are as follows:

The semiconductor chip high and low temperature test is a test box that simulates the environment. During use, there may be various extreme environments in the test box, such as low temperature, high temperature and high pressure, high temperature and high humidity and other special conditions.

If a low temperature test of -70°C is being performed in the test box, open the door of the test box at this time, and the cold air flow will overflow the test box. If our fingers touch the samples on the wall of the test box without any protection, they will be frozen instantly. , the muscle tissue at the frostbitten site may even necrosis. In addition, opening the door of the test chamber at a lower temperature may cause frost on the evaporator, which will affect the cooling speed, and may even cause problems such as damage to the compressor.

If the door of the test chamber is opened during a test at a high temperature of 150°C in the test chamber, the high-temperature gas will burst out of the test chamber in an instant. Combustibles may even cause a fire.

If it is other environmental test equipment, such as the constant temperature and humidity test chamber in the high temperature and high humidity test chamber, the pressure and steam in the instrument will be very large. If the door of the test chamber is opened at this time, there will also be high temperature and high humidity steam. Running out of the test chamber is also more likely to cause serious burns to the operator.

Therefore, in the middle of the high and low temperature test of the semiconductor chip, if it is not necessary to open the door of the test box, do not open the door of the test line. Open the test chamber door.

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Products                                                                                                           

TES Series (Custom Designs)

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations.

LTS Series (Fluorinated Liquid) (Custom Designs)

Widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer medium.

FLT Series (Custom Designs)

The semiconductor temperature control system chiller is mainly used for precise temperature control in the semiconductor production process and testing process. It is specially developed and designed for the semiconductor industry.

FLTZ Series Frequency Conversion (Custom Designs)

Double frequency conversion series temperature control system, circulation pump and compressor are all adjusted by frequency conversion.

ETCU Series (Custom Designs)

Heat exchange type

System without compressor

ZLFQ Series (Custom Designs)

Coolant Distribution Unit

Liquid cooling equipment is suitable for semiconductor testing, electronic equipment constant temperature testing, cooling server supporting infrastructure, and other fluid temperature control places.

MD Thermal Chucks Series (Custom Designs)

It is used for testing RF devices and high-density power devices (IGBTs and MOSFETs), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.

Gas Temperature Control Systems                                                               

AES Series Jet Impact Testing Machine

(Custom Designs)

Temp Control Range: -120°C ~ +225°C

AI Series Recirculating Air Temperature Control System

(Custom Designs)

Temp Control Range: -105°C ~ +125°C

LQ Series Gas Refrigeration System

(Custom Designs)

Temp Control Range: -110°C ~ -40°C

YQH Series VOCs Waste Gas Condensation Recovery Device

(Custom Designs)

Applied to gas condensation liquefaction recovery. The exhaust gas or other electronic gases are connected to the equipment through the induced draft fan (vacuum pump), liquefied, collected and separated into the collection tank by lowering the temperature, and other gases are discharged, so as to realize the condensation, capture and recovery of the gas.

ZLJ / SLJ Series (Custom Designs)

It is suitable for places where the heat exchange area of the heat exchanger is small but the heat exchange capacity is large. It can also be used for gas capture, the refrigerant is directly passed into the trap to evaporate, and the gas in the space is quickly captured through the condensation effect on the surface of the trap.