Knowledge of Semiconductor Chip High and Low Temperature Testing Machines

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Semiconductor chip high and low temperature test is a necessary test equipment for metal, components, electronics and other material industries. It is used to test the degree of material structure or composite material that can be endured in a continuous environment of high temperature and low temperature in a short time. The chemical change or physical damage caused by thermal expansion and contraction of the internal test sample.
The high and low temperature test of semiconductor chips has simple and convenient operation performance and reliable equipment performance. Physical changes in defense industry, aerospace, BGA, PCB base, electronic chip IC, semiconductor ceramics and polymer materials.

Special attention should be paid to the high and low temperature test of semiconductor chips. The high and low temperature test of semiconductor chips cannot be easily opened during use. The main reasons are as follows:

The semiconductor chip high and low temperature test is a test box that simulates the environment. During use, there may be various extreme environments in the test box, such as low temperature, high temperature and high pressure, high temperature and high humidity and other special conditions.

If a low temperature test of -70°C is being performed in the test box, open the door of the test box at this time, and the cold air flow will overflow the test box. If our fingers touch the samples on the wall of the test box without any protection, they will be frozen instantly. , the muscle tissue at the frostbitten site may even necrosis. In addition, opening the door of the test chamber at a lower temperature may cause frost on the evaporator, which will affect the cooling speed, and may even cause problems such as damage to the compressor.

If the door of the test chamber is opened during a test at a high temperature of 150°C in the test chamber, the high-temperature gas will burst out of the test chamber in an instant. Combustibles may even cause a fire.

If it is other environmental test equipment, such as the constant temperature and humidity test chamber in the high temperature and high humidity test chamber, the pressure and steam in the instrument will be very large. If the door of the test chamber is opened at this time, there will also be high temperature and high humidity steam. Running out of the test chamber is also more likely to cause serious burns to the operator.

Therefore, in the middle of the high and low temperature test of the semiconductor chip, if it is not necessary to open the door of the test box, do not open the door of the test line. Open the test chamber door.

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