Semiconductor Wafer Testing Temperature Control System

The wafer testing temperature control system is a key equipment used in semiconductor production to accurately control the wafer temperature to ensure product quality and performance. It consists of a temperature control device, a temperature sensor, a control algorithm and data acquisition, and will face higher precision and accuracy in the future. Stability challenges.

Principle and composition of semiconductor wafer testing temperature control system

The basic principle of the wafer testing temperature control system is to ensure that the wafer is in a constant temperature state during the semiconductor testing process through precise temperature control and stability. The temperature of the wafer has an important impact on the performance and reliability of semiconductor devices. Therefore, testing the stability and accuracy of the temperature control system is very critical. The system usually consists of the following parts:

1. Temperature control device: Responsible for providing the required temperature control.

2. Temperature sensor: monitor temperature changes in real time.

3. Control algorithm: Adjust according to the monitored temperature changes to maintain the set temperature.

4. Data collection: Collect temperature data for analysis and recording.

Application fields of semiconductor wafer testing temperature control system

1. Semiconductor production: Functional and reliability testing of chips.

2. Semiconductor packaging: testing and evaluating packaging materials.

3. R&D and education: testing and verification of new materials and new processes.

Solutions for wafer testing

Wafer high and low temperature testing has become increasingly important in fields such as automotive electronics, photovoltaics, and industrial automation. Challenges include:

1. Temperature uniformity control: ensure a precise temperature environment.

2. Temperature rise and fall rate: The rate is increased through zone temperature control and reforming.

3. Reduce the impact of high temperature on components: avoid oxidation and physical deformation.

The wafer testing temperature control system plays a decisive role in the quality of semiconductor products. With the development of technology, systems face higher requirements and require continuous innovation and improvement to adapt to new challenges. Through research and technical solutions, the performance of the system can be improved and the quality and reliability of semiconductor devices can be ensured.

We provide complete temperature control systems design and manufacturing. From standard models to complete customized products. We specialize in customer service and are dedicated to helping each customer have the optimal temperature control system for their specific need.

We provide non-standard customized solutions. Both single cooling chillers and cooling & heating combo units are available.

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TES Series (Custom Designs)

Suitable for precise temperature control of electronic components. In the manufacture of semiconductor electronic components for harsh environments, the IC packaging assembly and engineering and production testing phases include electronic thermal testing and other environmental testing simulations.

LTS Series (Fluorinated Liquid) (Custom Designs)

Widely used in the semiconductor manufacturing process to control the temperature of the reaction chamber, the temperature of the heat sink, and the temperature control of the non-flammable fluid of the heat transfer medium.

FLT Series (Custom Designs)

The semiconductor temperature control system chiller is mainly used for precise temperature control in the semiconductor production process and testing process. It is specially developed and designed for the semiconductor industry.

FLT Multi Channel Temp Contol (Custom Designs)

Multi channel independent temperature control, which can have a separate temperature range, cooling and heating capacity, thermal conductivity medium flow rate, etc., adopts two independent systems. According to the required temperature range, steam compression refrigeration or ETCU non compressor heat exchange system can be selected. The system can be used for universal expansion tanks, condensers, cooling water systems, etc., which can effectively reduce equipment size and operation steps.

FLTZ Series Frequency Conversion (Custom Designs)

Double frequency conversion series temperature control system, circulation pump and compressor are all adjusted by frequency conversion.

ETCU Series (Custom Designs)

Heat exchange type

System without compressor

ZLFQ Series (Custom Designs)

Coolant Distribution Unit

Liquid cooling equipment is suitable for semiconductor testing, electronic equipment constant temperature testing, cooling server supporting infrastructure, and other fluid temperature control places.

MD Thermal Chucks Series (Custom Designs)

It is used for testing RF devices and high-density power devices (IGBTs and MOSFETs), and can also be used for rapid cooling of laboratory flat panels (plasma, biological products, batteries), etc.

AES Series Jet Impact Testing Machine

(Custom Designs)

Temp Control Range: -120°C ~ +225°C

AI Series Recirculating Air Temperature Control System

(Custom Designs)

Temp Control Range: -105°C ~ +125°C

LQ Series Gas Refrigeration System

(Custom Designs)

Temp Control Range: -110°C ~ -40°C

YQH Series VOCs Waste Gas Condensation Recovery Device

(Custom Designs)

Applied to gas condensation liquefaction recovery. The exhaust gas or other electronic gases are connected to the equipment through the induced draft fan (vacuum pump), liquefied, collected and separated into the collection tank by lowering the temperature, and other gases are discharged, so as to realize the condensation, capture and recovery of the gas.

ZLJ / SLJ Series (Custom Designs)

It is suitable for places where the heat exchange area of the heat exchanger is small but the heat exchange capacity is large. It can also be used for gas capture, the refrigerant is directly passed into the trap to evaporate, and the gas in the space is quickly captured through the condensation effect on the surface of the trap.