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GD-518-2-C Multi -layer Semiconductor Packaging Test Chamber

GD-518-2-C Multi -layer Semiconductor Packaging Test Chamber

  • Applied to Semiconductor Packaging Test
  • Comprehensive Energy Saving is More Than 35%.

 

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Semiconductor packaging test chamber

 

This series of products is mainly used for semiconductor packaging testing. The equipment is divided into two test boxes on the left and right, which can simultaneously test multiple layers of chips with load, providing a reliable environment for chip reliability testing and verification.

 

GD-518-2-C
Temperaturbereich-70℃ ~ +150℃
KältemittelR404A/R23
Genauigkeit der Temperaturregelung±0.1℃
Rise or fall rate≤ 5min
Temperature uniformity<=3 ℃
KompressorBrand inverter compressor
ControllerSelf-programmed self-tuning algorithm
Stromversorgung380v/50HZ

 

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